In order to verify proper device operation and characterization, a method must exist to interface the test equipment to the actual device to be tested. This interface capability must support a large number of signals, as well as signals exhibiting high frequency and/or wide bandwidth characteristics. Much of our work is performed using advanced microprobing techniques for probing fine geometries at the integrated circuit (IC) die and multichip module (MCM) substrate level. The test facility has more than a dozen probe stations featuring both manual and automated micro-positioning, optical and digital imaging, vibration-free air tables, and modularity for customizing the test setup for a variety of applications. Included are a large variety of wide bandwidth microwave probes (some probes exhibit upper frequencies of 40 GHz, while others exhibit upper frequencies of 220 GHz), high impedance shielded probes, membrane probes, and high I/O count needle probes. Specialty test fixtures and test sockets have been developed for package device applications.
